Abstract: The through silicon via (TSV) arrays play the role of vertical electrical interconnections in the 3-D stacked integrated circuits. However, the coupling crosstalk between the adjacent TSVs ...

Institute of Advanced Technology on Semiconductor Optics and Electronics, School of Physics and Optoelectronic Engineering, Beijing University of Technology, Beijing 100124, China ...

Abstract: This work introduces a metamaterial cover layer designed to extend the scan range of patch-antenna phased arrays in both principal planes without compromising directivity. The key innovation ...

This Review Article takes an original angle and covers several aspects of the leukocytes extravasation process with a focus on the role of ECM proteins. It is a timely piece with an original viewpoint ...