Abstract: Time-dependent dielectric breakdown (TDDB) is one of the important failure mechanisms for copper (Cu) interconnects. This problem becomes more severe as the pitch between wires is shrinking ...

Abstract: Vias in printed circuit boards and chip packages are known to have significant detrimental impact on signal and power integrity in high-speed communication systems. Recently, concise ...

The libraries used for import/export are only compiled for Windows x64. This add-on will not currently work on other OSes. Files > Import > PSO2 Model Search opens a window to find an import items by ...