Cooler Master has announced the launch of a new thermal compound, dubbed the MasterGel Maker, with a 11W/mK thermal conductivity and high viscosity for easy spreading. Designed to compete with rival ...

The new special purple-colored thermal paste from Cooler Master that better bonds to your PC hardware, with a nano-particle component that features improved thermal conductivity. The non-corrosive and ...

Thermal paste, also sometimes called thermal compound or grease, is a common element used when building one's own PC or rehabilitating an old unit. This substance is usually sold in tube-shaped ...

PC cooling specialist Cooler Master has just unveiled a new colored thermal paste range, with its latest grease coming in several bright hues, including green, red, and yellow. In fact, the blobs of ...

Okay, so this is more for marketing than something you'd consider practical - Cooler Master has used its Cryofuze 5 thermal paste to paint a landscape mural on a CPU. Available in a range of colors, ...

WTF?! Are you tired of using the same old silver or greyish thermal paste? Wouldn't it be great if somebody made an outlandishly colored material that would look great as it's being applied, even if ...

The Taiwan-based company Cooler Master make things like cases, power supplies, CPU coolers and other parts and accessories for people interested in building their own computers. It’s now announced it ...

If you've every thought thermal paste was a bit boring, you would have been right...until today! Cooler Master for some reason or another has decided to paint a CPU using its multi-colored Cryofuze 5.

Forget digital art, give me that real-world, touchable, sniffable stuff. In fact, forget oils and pencils, give me a few tubes of coloured thermal paste and an Intel chip and let me go to town. Oh… ...

Cooler Master has found a creative way to market its CPU thermal paste: using it to paint a mountain scene on a CPU. Cooler Master posted a video featuring the Cryofuze 5 thermal paste, which it ...

Thermal Compound is used for promoting better heat conduction between two surfaces. It is commonly used between a microprocessor and a heatsink. Usually, the microprocessor’s top surface is not ...