Abstract: 2.5D glass interposer technology based on through glass via (TGV) becomes a hot research topic on account of good electrical property and CTE (coefficient of thermal expansion) mismatch [1].

Abstract: Aiming at the problem of poor robustness of model-based maximum torque per ampere (MTPA) algorithm, a sliding mode extremum search control based MTPA (SMESC-MTPA) method with d-axis current ...

Accessory Dwelling Units (ADUs) continue to reshape residential design in 2025. Whether used as a rental, home office, or a private space for family, these compact homes offer flexibility and ...