Through the application of epoxy flux, flip chip packaging solder joints can obtain better mechanical strength and electrical ...

Abstract: During the service life of electronic packages, solder joints undergo thermal cycling which occurs between low to high temperature extreme. Also, solder joints can experience same exposure ...

Abstract: In this article, the random vibration test and finite-element simulation analysis of SAC305 solder joints in BGA packaged electronic chips were carried out. A failure model for BGA solder ...

This article will help you build a simple Arduino-based DCC system. Growing up in the 1980s I was living the dream. I had an ...

A research team led by Kyushu University has developed a new fabrication method for energy-efficient magnetic random-access memory (MRAM) using a new material called thulium iron garnet (TmIG) that ...

Electrical Industries reports SAR 260.1M profit in H1 2025; Q2 at SAR 136.7M 6 M 2025 Electrical Industries profit surges 64% to SAR 123.4M in Q1 2025 3 M 2025 Electrical Industries earns SAR 401.7M ...

DELO has conducted extensive reliability tests on directional conductive adhesives, confirming their suitability as a robust ...

Do not touch a person who is still connected to an electrical source because they can pass the electrical current on to you. Call 911 if someone has an electric shock, especially if they have signs ...

Innovation is key in the steadily growing computer engineering field. Our graduates are prepared for R&D, and fields, ranging from movie special effects to nanotechnology. Contribute to the 21st ...

The subject engine block heaters are listed under two part numbers by the Ford Motor Company in the recall documentation ...