We really don't need AI devices when we have AR glasses. One thing that no one realized is that they're perfect for AI.

西门子数字化工业软件电路板系统高级副总裁 AJ Incorvaia 表示：“西门子与台积电的合作由来已久，我们很高兴合作开发出一套由 Innovator3D IC 驱动的、经过认证的 Xpedition Package Designer ...

The organization is the state’s initial PRO under its Packaging Waste and Cost Reduction Act, which establishes EPR for ...

Bic said its sales continued to increase in 2024, helped by growing demand for razors more than offsetting a decline in ...

The global semiconductor manufacturing industry closed 2024 with strong fourth quarter results and solid year-on-year (YoY) ...

The world's first tri-fold smartphone has just become a global product. The device in question is the Huawei Mate XT, of ...

According to Siemens, and in collaboration with TSMC, it has delivered a certified Xpedition Package Designer automated ...

With the global semiconductor market projected to exceed US$1 trillion within the next decade, IC packaging and testing ...

Siemens Digital Industries Software has come out with an automated and certified workflow for TSMC’s InFO packaging ...

ASE has officially launched its fifth plant in Penang, which will significantly build on the company’s strong packaging and ...

Taiwan's total IC industry output value—including IC design, IC manufacturing, IC packaging, and IC testing—was NT$1.49 ...