Even though companies sell packaged devices and not bare chips, the chips are often designed in isolation and may be either overdesigned or too large to fit the package. When chip-level I/O planning ...
Integrating processors, sensors, and data exchange functionality into everyday objects, the Internet of Things (IoT) pushes computing capabilities far beyond desktops and servers. On December 5, ...
The Spinner I/O fabric generation tool for automated, bug-free I/O fabric synthesis of complex SoCs is said to automatically generate and validate the RTL for the complete I/O layer of an IC from a ...
Mark Papermaster is chief technology officer and senior vice president of Technology and Engineering at AMD, responsible for corporate technical direction, product development including system-on-chip ...
TSMC 90nm PCI Express* 2.5Gbps design fully characterized and compliant to specification Los Altos, California, United States - November 20, 2006 -- Rambus Inc. (Nasdaq: RMBS), one of the world's ...
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