BOPLA, a specialist developer of electronic enclosures, has introduced BoVersa, a new enclosure concept that’s been designed ...

BOPLA has introduced BoVersa, an innovative new enclosure concept designed for next-generation wireless, embedded, and instrumentation systems. Combining modern design with robust engineering, it ...

Optimised for wireless and cooling Flexible design options for demanding indoor and outdoor applications.   BOPLA , a ...

In the world of digital fabrication, the line between industrial capability and desktop convenience has always been sharply ...

Only innovations/new products or innovative manufacturing processes that are presented at the productronica 2025 exhibition ...

Biodegradable printed circuit boards are being tested for use in wireless communication technologies, through a collabora ...

Elektor engineer Saad Imtiaz shares his workflow for designing 3D-printed enclosures using tools like SolidWorks, Onshape, ...

CircuitDigest presents the Smart Home & Wearables Project Contest 2025! Win exciting prizes worth up to ₹7,00,000 and receive ...

Experts date the beginning of the tech boom to somewhere in the 1990s. We've been living with microchips, laptops, and ...