Abstract: In this paper, the authors propose two solutions for thick embedding capacitor that can be embedded in extremely large Flip Chip Ball Grid Array (FC-BGA) Package (PKG) using a Thick Core ...
Abstract: In this article, a deep reinforcement learning (DRL) approach that optimizes the power/ground ball map design within the ball grid array (BGA) package of 3-D-integrated circuits (ICs) ...
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