A new technical paper titled “Ultrafast Semiconductor Chip Bonding Using Intense Pulsed Light Soldering for Chip-on-Glass Packaging” was published by researchers at Sungkyunkwan University and ...

Littelfuse Inc. extends its K5V Series of illuminated tactile switches with the release of new K5V4 models including the gull-wing and 2.1-mm pin-in-paste (PIP) versions compatible with reflow ...

Phoenix Contact now offers right-angle M12 connectors for through-hole reflow (THR) soldering processes. Phoenix Contact now offers right-angle M12 connectors for through-hole reflow (THR) soldering ...

Abstract: In view of the complexity and high cost of temperature curve setting in reflow soldering process of multi variety and small batch products, and the existing process simulation methods of PCB ...

Mini-Circuits has developed products having a lead-less LTCC (Low Temperature Co-fired Ceramic) substrate that serves as the base of the unit. Examples of such products are the SBTC series of power ...

Abstract: Investigation deals with application of new kind of soldering equipment and development of reflow soldering processes for electronic devices using this equipment. It is based on low inert ...