A new technical paper titled “Ultrafast Semiconductor Chip Bonding Using Intense Pulsed Light Soldering for Chip-on-Glass Packaging” was published by researchers at Sungkyunkwan University and ...

Article subjects are automatically applied from the ACS Subject Taxonomy and describe the scientific concepts and themes of the article. Glass substrates have gained considerable attention as ...

Littelfuse Inc. extends its K5V Series of illuminated tactile switches with the release of new K5V4 models including the gull-wing and 2.1-mm pin-in-paste (PIP) versions compatible with reflow ...

Reflow soldering machines are essential equipment in the electronics manufacturing industry, used for soldering electronic components to printed circuit boards (PCBs). This process involves applying ...

This application note provides guidelines for board mounting of surface mount semiconductor packages. Nowadays, reflow soldering is a widely spread technology for soldering of surface mount ...

Abstract: Investigation deals with application of new kind of soldering equipment and development of reflow soldering processes for electronic devices using this equipment. It is based on low inert ...