Researchers focus on limiting data movement to reduce power and latency in edge devices. In popular media, “AI” usually means ...

Abstract: In this paper, authors propose a new type of trough silicon via (TSV)-based stacked silicon capacitor (SSC). This SSC is designed by stacking two silicon capacitor wafers, thereby connecting ...

Metalysis, based in Rotherham, UK, reports it has added two more Gen 2 demonstration units, doubling its capacity to meet ...

Abstract: Virtual inertia (VI) control of dc microgrids (dc MG) is a potential solution to the voltage stability issue caused by the intermittency of loads and renewable sources. Existing VI ...