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A sub-band cooperative beamforming method is proposed for onboard digital transparent processor, which may be affected in orbit by the harsh electromagnetic environment. In the proposed scheme, ...

BANNOCKBURN, IL – North American printed circuit board (PCB) shipments jumped 21.4% year-over-year in May, according to new data from the IPC trade group. Shipments increased 7.1% month-to-month, with ...

Austin, Texas – High Density Packaging User Group (HDP) is pleased to announce that Lincstech Co., Ltd. (Lincstech) has become a member. “Lincstech has been supporting the electronics industry with ...

The Dawn of Dual In-Line Packages Back in the 1960s, some engineers at Fairchild came up with the Dual In-Line Package (DIP). This was a game-changer. It was basically the first real semiconductor ...

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Goal 2 is about creating a world free of hunger by 2030.The global issue of hunger and food insecurity has shown an alarming increase since 2015, a trend exacerbated by a combination of factors ...