STMicroelectronics has introduced the ST25DA-C, a secure NFC chip that supports Matter 1.5 for one-step integration of smart home devices. The chip enables users to add items such as lighting, access ...

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Tata Electronics and the Centre for Development of Advanced Computing (C-DAC), under the Ministry of Electronics and Information Technology (MeitY), signed a Memorandum of Understanding (MoU) to ...

At the 2025 TSMC North America Open Innovation Platform (OIP) Ecosystem Forum, Siemens Digital Industries Software announced new collaborations with TSMC to support the foundry’s latest process ...

Samsung Electronics has begun mass production of its one-terabit (Tb) quad-level cell (QLC) 9th-generation vertical NAND (V-NAND). With the industry’s first mass production of QLC 9th-generation ...

Toshiba announces the Mx11 family of helium-sealed high-capacity HDDs. The Mx11 family includes the MG11 Series, which provides capacities of up to 24TB using conventional magnetic recording (CMR), ...

5G RedCap was finalized in the 3GPP’s Release 17 to provide device OEMs with a migration pathway from 4G LTE to 5G for mid-range devices, whose throughput requirements sit between those of enhanced ...

SK hynix developed the industry’s first 16Gb DDR5 built using its 1c node, the sixth generation of the 10nm process. The success marks the beginning of the extreme scaling to the level closer to 10nm ...

ABI Research said the chipset revenues from AI-dedicated silicon for IoT-focused applications reaching over US$7.3 billion by 2030. The trend driving this growth is due to embedded chipset vendors ...

SK hynix has developed the Zoned UFS, or ZUFS1 4.0, a mobile NAND solution product for on-device AI applications. SK hynix said that the ZUFS 4.0, optimized for on-device AI from mobile devices such ...

Intel said starting third quarter of 2024 in time for the holiday season, Intel’s upcoming client processors (code-named Lunar Lake) will power more than 80 new laptop designs across more than 20 ...