We present a simple Die-to-Wafer bonding process enabled by atmospheric plasma, eliminating the need for complicated carrier wafers and costly vacuum plasma systems. Applications include heterogeneous ...

Aehr Test Systems announced it has received initial follow-on production orders totaling approximately $4.7 million from a major storage device supplier. The orders include ... Semiconductor Packaging ...

The Nomination Committee for Mycronic's 2025 Annual General Meeting has been appointed in accordance with the instructions for the Nomination Committee ... The Science Based Target initiative has ...

Leading IC manufacturing and technology services provider increases chip-on-wafer (CoW) yield by 3.3% from 96.47% to 99.66% with Nordson Electronics Solutions.

Two case studies show how advanced high-resolution 3D XRM can detect and visualize defects in Wafer Level Chip Scale Packages (WLCSP) containing RDL and Cu pillar microbumps.

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. For flip chips with very small geometries, copper ...

YINCAE announced the launch of its groundbreaking underfill material, UF 158UL. This cutting-edge product is designed to meet the increasing demands of large format chips ... YINCAE ha announced the ...

Greenliant will highlight its high endurance, industrial solid state drives (SSDs) and memory cards at embedded world 2025 in Nuremberg, Germany, March 11-13, in hall 2 ... Semiconductor Packaging ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. EVG's industry-leading process solutions, expertise ...

Littelfuse, Inc. announced the release of its new 823A Series Fuse, an AEC-Q200-qualified, high-voltage-rated surface-mount (SMD) fuse with high interrupting ratings. ... Littelfuse, Inc. announces ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Fan-out Wafer-Level (FOWLP) and Fan-out Panel-Level (FOPLP) semiconductor packaging benefit from plasma treatment, which ensures surfaces are contamination-free to aid the attachment process, ...